دستهبندی: لوازم جانبی هویه
سایر توضیحات:It can be used for rework, sphere or pin attachment to BGA, PGA, and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reball.
Excellent capacity of solder-stickiness
Excellen
نوع:روغن
رنگ:سفید

